Driving Precision & Scalability in High-Volume PCB/PCBA Manufacturing for Automotive, Industrial & IoT Applications | Expert in SMT Process Optimization, DIP Assembly & Traceability System Design
With 8+ years of deep technical expertise in end-to-end PCB/PCBA manufacturing, I specialize in bridging design intent with high-volume production reality for automotive, industrial control, and IoT electronics. My core focus is optimizing SMT placement accuracy, DIP soldering reliability, and full-process traceability to deliver 99.7%+ first-pass yield for complex assemblies. I have led cross-functional teams to implement: SMT Process Optimization: Introduced AI-driven component placement calibration and 3D SPI (Solder Paste Inspection) systems, reducing solder defects by 32% in high-mix production lines. Traceability System Design: Built a QR-code based lot/batch/serial tracking framework that links raw component data, SMT 贴装 logs, and functional test results to support IATF 16949 and...