What was your experience transitioning to a smaller process node in semiconductor fabrication? What unexpected hurdle did you face and how would you advise others to prepare for it?

Moving to a smaller process node was exciting and challenging. One surprise I hit was yield variability - smaller geometries made even small defects more impactful, and we saw higher than expected scrap rates. To address this I added more inline testing and process monitoring, so we could catch anomalies early and adjust parameters in real time. I also increased collaboration between design and fab teams to anticipate hotspots before they became issues. My advice to others moving to a smaller node is to invest heavily in data driven process control and cross team communication upfront. Know that variability will be higher and build systems to detect and respond quickly and you will save time and cost in the long run. Being proactive not reactive is key to a smooth node transition.